Flash Programmable Capacitor Tuning Array Die
for Crystal Oscillator(XO)
CY2048WAF
Cypress Semiconductor Corporation • 3901 North First Street • San Jose, CA 95134 • 408-943-2600
Document #: 38-07738 Rev. *A Revised December 12, 2005
Features
• Flash-programmable capacitor tuning array for low
ppm initial frequency clock output
• Low clock output jitter
— 4 ps typ. RMS period jitter
— ±30 ps typ. peak-to-peak period jitter
• Flash-programmable dividers
• Two-pin programming interface
• On-chip oscillator runs from 10–48-MHz crystal
• Five selectable post-divide options, using reference
oscillator output
• Programmable asynchronous or synchronous OE and
PWR_DWN modes
• 2.7V to 3.6V operation
• Controlled rise and fall times and output slew rate
Benefits
• Enables fine-tuning of output clock frequency by
adjusting C
Load
of the crystal
• Allows multiple programming opportunities to correct
errors, and control excess inventory
• Enables programming of output frequency after
packaging
• PPM clock output error can be adjusted in package
• Provides flexibility in output configurations and testing
• Enables low-power operation or output enable function
• Provides flexibility for system applications through
selectable instantaneous or synchronous change in
outputs
• Enables encapsulation in small-size, surface-mount
packages
Block Diagram
Die Pad Description
Horizontal Scribe
Vertical
Scribe
Y (max)
X(max)
6
OUT
2
3
4
VDD
XIN
PD#/OE
5
7C80330A
1
XOUT
die#/rev
VSS
Notes:
X(max): 980 µm, Y(max): 988 µm
Bond pad opening: 85 µm x 85 µm
Pad pitch: 175 µm (min.)
Scribe: X = 70 µm, Y = 86 µm
Wafer thickness: 11 mils (Typ.)
PD#/OE
VSS
VDD
(SDATA/VPP)
XIN
XOUT
CRYSTAL
OUT
/ 1, 2, 4, 8, 16
OSCILLATOR
CONFIGURATION
(SCL)
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