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Dell PowerEdge M910 Technical Guide 2
Table of Contents
1 Product Comparison ........................................................................................... 5
1.1 Overview .................................................................................................. 5
1.2 Product Comparison ..................................................................................... 6
2 New Technologies .............................................................................................. 8
2.1 Overview .................................................................................................. 8
2.2 Detailed Information .................................................................................... 8
2.2.1 Intel Xeon Processors .............................................................................. 8
2.2.2 Intel 7500 Chipset .................................................................................. 8
2.2.3 FlexMem Bridge .................................................................................... 8
2.2.4 IO Hub (IOH) with Intel QuickPath Architecture ............................................... 8
2.2.5 DDR3 Memory ....................................................................................... 8
2.2.6 PCI Express Generation 2 ......................................................................... 9
2.2.7 Internal Redundant SD Module ................................................................... 9
2.2.8 iDRAC6 Express ..................................................................................... 9
3 System Information .......................................................................................... 10
3.1 Overview ................................................................................................ 10
3.2 Product Features Summary ........................................................................... 10
4 Mechanical .................................................................................................... 12
4.1 Overview ................................................................................................ 12
4.2 Module Dimensions and Weight ...................................................................... 12
4.3 Internal Module ......................................................................................... 12
4.4 Security .................................................................................................. 13
4.5 Cover Latch ............................................................................................. 13
4.6 TPM (Trusted Platform Module) ...................................................................... 13
4.7 Power Off Security ..................................................................................... 14
4.8 USB Key .................................................................................................. 14
4.9 Battery ................................................................................................... 14
4.10 Field Replaceable Units (FRU)........................................................................ 14
5 Operating, Thermal, and Acoustic ......................................................................... 15
5.1 Overview of Operating and Storage Conditions .................................................... 15
5.2 Acoustics ................................................................................................ 16
5.3 Thermal.................................................................................................. 17
5.4 Power Efficiency ....................................................................................... 17
6 Processors ..................................................................................................... 18
6.1 Overview ................................................................................................ 18
6.2 Features ................................................................................................. 18
6.3 Supported Processors .................................................................................. 19
6.4 Processor Configurations .............................................................................. 19
6.5 FlexMem Bridge ........................................................................................ 19
7 Memory ........................................................................................................ 21
7.1 Overview ................................................................................................ 21
7.2 DIMMs Supported ....................................................................................... 22
7.3 Slots /Risers ............................................................................................. 22
7.4 Intel 7500 Scalable Memory Buffer (SMB) ........................................................... 22
7.5 Memory RAS Support ................................................................................... 22
7.5.1 Sparing ............................................................................................. 22
7.5.2 Mirroring ........................................................................................... 23
7.5.3 Supported Memory Configurations ............................................................. 24