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24888 Rev 3.03 - July 12, 2004 AMD-8151
TM
AGP Tunnel Data Sheet
42
8 Package Specification
Figure 4: Package mechanical drawing.
AMD
Øb
PACKAGE
D1/E1
D2/E2
SYMBOL
D/E
D3/E3
aaa
bbb
ccc
6. "x" in front of package variation denotes non-qualified package
c) Die and passive fudicials
a) Marking on die, label on package
7. The following features are not shown on drawings:
on a plane parallel to datum C.
5. Dimension "b" is measured at maximum solder ball diameter
4. Symbol "M" determines ball matrix size and "N" is number of balls.
of the package identifies ball A1 corner and can be used for
handling and orientation purposes.
1. All dimensions are specified in millimeters (mm).
2. Dimensioning and tolerancing per ASME-Y14.5M-1994.
3. This corner which consists of a triangle on both sides
TOP VIEW
SIDE VIEW
b) Laser elements
per AMD 01-002.3.
A2
GENERAL NOTES
M
N
A1
A
LID
E
A2
e
A1
A
BOTTOM VIEW
NOT TO SCALE
A1 CORNER
D
D1
0.9
0.125
0.6
0.2
0.25
24
564
max.
VARIATIONS
31.2
29.21 BSC.
28.2
SEE NOTES
23.2
3.56
0.7
1.1
27.8
1.27 BSC
22.8
3.25
0.5
0.9
min.
30.8
xOLF564
Øb (Nx Plcs)
e
E1
A1 CORNER
E3
D2
E2
D3