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Corrective Maintenance
Maintenance
6Ć66
The procedures for removing and replacing the FRU ICs in the CSA 803C
are outlined in this section.
Serial Data Interface Integrated Circuits (SlamĆPack" ICs)
U330 is mounted on the A14 I/O board. See Figure 6Ć30 for the location of
this IC. It has a raised, ridged, heat sink cover. The IC is oriented to its
socket by a beveled corner. The other corners are notched to fit the edges
of the socket. The beveled corner aligns with a spring (small metal tab) at
one corner of the socket. An example of the IC is shown in Figure 6Ć32.
To remove the Serial Data Interface IC, proceed as follows:
ăStep 1:ăRemove the A14 I/O board.
ăStep 2:ăHold the heat sink cover in place and unfasten the retaining clip
by moving the retaining clip across the tabs while pushing down slightly
on the cover.
CAUTION
To prevent static damage to the instrument or components, observe
all the special precautions mentioned under StaticĆSensitive ClassiĆ
fication in this section.
ăStep 3:ăRemove the cover slowly to prevent the IC from falling out.
Before removing the IC, note the position of the IC index for later use.
ăStep 4:ăRemove the IC with tweezers.
CAUTION
Finger oils can degrade reliability of components. Avoid touching
the IC or its socket contacts with your fingers.
FRU IC Removal